Integral INSSD64GP25MXZ Datenblatt PDF herunterladen (Seite 7)

7

-CBLID(Cable assembly

type identify)

37, 38

-CS0, -CS1(Chip select)

I

These signals are used to select

the Command Block and Control

Block registers. When –DMACK is

asserted, -Cs0 and –Cs1 shall be

negated and transfers shall be

16-bit wide.

39

-DASP(Device active,

Device 1 present)

I/O

During the reset protocol, -DASP

shall be asserted by Device 1 to

indicate that the device is present.

41, 42

VCC

P

Power supply

02, 19, 22, 24,

26, 30, 40, 43

GND

--

Ground.

*Note:

“I” An input from the host system to the device.

“O” An output from the device to the host system.

“I/O” An input/output(bi-direction) common.

“P” Power supply.

3.0 Electrical Characteristics

3.1 Absolute Maximum Rating

Ite

m

Symbol

Parameter

MIN

MAX

Unit

1

V

DD

-V

SS

DC Power Supply

-0.3

+5.5

V

2

VIN

Input Voltage

Vss-0.3

V

DD

+0.3

V

3

Ta

Commercial Operating

Temperature

0

+70

0

C

4

Tst

Commercial Storage

Temperature

-25

+85

0

C

5

Ta

Industrial Operating

Temperature

-40

+85

0

C

6

Tst

Industrial Storage

Temperature

-40

+85

0

C

Parameter

Symbol

MIN

TYP

MAX

Unit

3.0

3.3

3.6

V

V

DD

Voltage

V

DD

4.5

5.0

5.5

V

1 2 3 4 5 6 7 8 9 10 11 12 ... 24 25

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